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CPU graphics PCB circuit board, gold finger plating and gold deposition process BGA laser drilling circuit board
CPU graphics PCB circuit board, gold finger plating and gold deposition process BGA laser drilling circuit board
CPU graphics PCB circuit board, gold finger plating and gold deposition process BGA laser drilling circuit board
CPU graphics PCB circuit board, gold finger plating and gold deposition process BGA laser drilling circuit board

CPU graphics PCB circuit board, gold finger plating and gold deposition process BGA laser drilling circuit board

ManufacturerShenzhen City Electro-Team Limited
CategoryCircuit/line boards
Price
BrandDCPCB
outer copper thick5oz, 6oz, 4.5oz, 5.5oz, 0.5oz, 1.5oz, 1oz, 2oz, 3oz, 4oz
ComplementFR4 Plus
Whether or not to export a source of goods exclusively across bordersYes
Weld surface treatmentSilver, gold, tin, lead-free tin, lead tin, electroplating, OSP
GoodsDC-YSJR-L
Board OptionsFire retardation
FormMechanical, membrane, laser, mold.
Test MethodFour-line low resistance test, 100% flyer test, AOI total + flyer full, flyer full, engineering test frame
Weld colourBlack, blue, purple, white, green, red.
Character colourBlack, white.
Layers22, 12, 24, 14, 26, 16, 28, 18, 1, 2, 3, 4, 6, 8, 30, 20, 10, 32
Special ProcessesCarbon oil, gold finger tilt, metal half hole, metal bag side.
Applicable industryElectronics
InterdictionYes.
Weld CoverPyramid.
Minimum aperture0.15
Thick1.0, 2.0, 0.3, 1.2, 3.0, 0.4, 0.6, 1.5, 1.6, 2.5, 0.8
ModelDCPCB-FPC
Insulation materialOther

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